Solder Preforms Au80sn20 for Laser Diode Packaging with Gold-Tin Solder

• Customization: Available
• Melting Point: 280°c
• Customized Support: OEM, ODM
• Model NO.: A01
• Certificate: RoHS, ISO 9001, ISO 14001, GB/T 29490
• Delivery Method: Air Freight
• Transport Package: Bulk, Waffle Box, Tape and Reel, Film-Wrap Package
• Specification: Au80Sn20 Preform
• Trademark: XianYi
• Origin: Guangzhou
• HS Code: 7115901020
• Production Capacity: 10000000

Product Description

AuSn Solder Preforms

Features:
-    Eutectic solder with a melting temperature of 280 ºC
-    Good wettability and high strength
-    Good thermal and electrical performance
-    High reliability and stability

Description:
Au80Sn20 is a eutectic alloy with melting temperature of 280ºC . It can be made into  a  variety   of  shapes  and  sizes  of preforms  to  meet   different  requirements. Au80Sn20 is suitable for applications requiring high temperature strength and thermal
fatigue resistance, and has the advantages of good wettability, high tensile strength and strong corrosion resistance. Au80Sn20 has the closest melting point to high lead solder, and can also avoid the corrosion of gold plating and pad shedding in soldering process on gold or palladium-silver pads. Compared with lead-free eutectic solder with low melting point, the solder has higher stability and reliability.

Au80Sn20 eutectic solder does not required flux in soldering, avoiding contamination and corrosion of semiconductor chips caused by flux use. Au80Sn20 are mainly used in the packaging of optoelectronics, high reliability and high-power electronic devices. 

Solder Composition: 

Element	Wt%
Gold (Au)	Margin
Tin (Sn)	20.0 ± 0.5

Physical Properties:

Product name	Melting point/ºC solid / liquid phase	Density g/cm3	Resistivity µΩ·m	Thermal conductivity W/m·K	Thermal expansion coefficient 10^-6/ºC	Tensile strength Mpa
Au80Sn20	280	14.52	0.224	57	16	276

Method of Use:

Reflow Profile

Reflow profile of Au80Sn20 Solder Preforms
(For reference only, the reflow profile should be adjusted according to the actual soldering situation)

 

Plating Thickness of Pads
A gold plating thickness ranging from 0.8~ 1.5μm is recommended for soldering.


Operation Details:
-    Picking up:
Use an anti-static tools to pick up the solder to prevent solder contamination and deformation.

-    Operating environment:

Atmosphere	Parameter requirements
N2	Oxygen concentration(200~ 1000ppm)
Vacuum	Vacuum degree ≤ 2.0×10-3Pa

-     Flux Compatibility:
Au80Sn20 solder is compatible with regular no-clean and water-soluble electronic grade fluxes currently.

Dimension Tolerance:

Thickness(t)	Typical tolerances for length, width or diameter(L/W/D)
t <0.40mm	±0.02mm
0.40mm≤ t <1.00mm	±0.03mm
t ≥1.00mm	±0.05mm
Thickness(t)	Thickness (t)
	Conventional solder alloys	Indium alloy
t<0.05mm	±0.005mm	±0.01mm
0.05mm≤ t <0. 10mm	±0.008mm	±0.01mm
0. 10mm≤ t <0.20mm	±0.01mm
0.20mm≤ t <0.40mm	±0.02mm
0.40mm≤ t <1.00mm	±0.03mm
t ≥1.00mm	±5%

Storage and Product Management:
-     Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.

-    Product management
Keep container tightly closed when product is not in use.

Safety:
-    Please use this product with adequate ventilation and certain personal protection conditions.
-    Please do not mix with other toxic chemicals.


List of Common Solders

Category	Products	Solidus(ºC)	Liquidus(ºC)	Density (g/cm3)	Resistivity (μΩ·m)	Thermal Conductivity (W/m  ·K)	CTE (10-6/ºC)	Tensile Strength (MPa)
Solder Metal	In51Bi32.5Sn16.5	/	60(e)	7.88	0.522	/	22	33.44
	In66.3Bi33.7	/	72(e)	7.99	/	/	/	/
	Bi50Pb28Sn22	/	100(e)	9.44	/	/	/	/
	In52Sn48	/	118(e)	7.3	0. 147	34	20	12
	In50Sn50	118	125	7.3	0. 147	34	20	11.86
	Bi58Sn42	/	138(e)	8.56	0.383	19	15	55. 16
	Bi57Sn42Ag1	138	140	8.57	/	/	/	/
	In97Ag3	/	143(e)	7.38	0.075	73	22	5.5
	Sn43Pb43Bi14	144	163	9.02	/	/	24	44. 1
	In80Pb15Ag5	149	154	7.85	0. 133	43	28	17.58
	Sn53Pb37Bi10	150	168	8.65	/	/	/	/
	Sn70Pb18In12	154	167	7.79	0. 141	45	24	36.68
	In100	/	157(mp)	7.31	0.072	86	29	1.88
	In70Pb30	165	175	8. 19	0. 195	38	28	23.79
	In60Pb40	174	185	8.52	0.246	29	27	28.61
	Sn77.2In20Ag2.8	175	187	7.25	0. 176	54	28	46.88
	Sn62Pb36Ag2	/	179(e)	8.42	0. 145	42	27	44
	Sn63Pb37	/	183(e)	8.4	0. 146	51	25	52
	In50Pb50	184	210	8.86	0.287	22	27	32.2
	Pb60In40	197	231	9.3	0.331	19	26	34.48
	Sn86.9In10Ag3. 1	201	205	7.37	/	/	/	/
	Au10Sn90	/	217(e)	7.78	/	/	/	50.2
	SAC387(Sn95.5Ag3.8Cu0.7)	/	217(ne)	7.4	0. 132	57	22	48
	SAC305(Sn96.5Ag3.0Cu0.5)	217	218	7.37	0. 132	58	21	50
	Sn96.5Ag3.5	/	221(e)	7.37	0. 108	33	30	39
	Sn99.3Cu0.7	/	227(e)	7.31	/	/	/	/
	Sn100	/	232(mp)	7.29	0. 111	73	24	13. 1
	Sn65Ag25Sb10	/	233(e)	7.8	/	/	36	117.2
	Sn95Sb5	235	240	7.25	0. 145	28	31	40.7
	Sn90Sb10	240	250	7.22	/	42	27	44
	Pb75In25	240	260	9.97	0.375	18	26	37.58
	Pb88Sn10Ag2	268	290	10.75	0.203	27	29	22.48
	Pb90Sn10	275	302	10.75	/	/	24.6	32
	Au80Sn20	/	280(e)	14.52	0.224	57	16	276
	Pb92.5Sn5Ag2.5	287	296	11.02	0.2	29	24	29.03
	Pb90Sn5Ag3In2	294	297	10.89	/	/	/	/
	Pb92.5In5Ag2.5	300	310	11.02	0.313	25	25	31.44
	Au88Ge12	/	361(e)	14.67	0. 151	44	13.4	185
	Au96.8Si3.2	/	363(e)	15.4	/	27	12	255
	Au98Si2	363	390	16.92	/	/	/	/
Brazing Metal	Ag60Cu30Sn10	600	720	9.58	/	/	/	/
	Ag72Cu28	/	780(e)	10	/	352	17.8	250-360
	Ag50Cu50	780	870	9.67	/	/	/	/
	Au60Ag20Cu20	835	845	13.79	/	/	/	/
	Ag92.5Cu7.5	/	/	10.37	/	/	/	/
	Au80Cu20	/	910(e)	15.67	/	/	/	/
	Au50Cu50	955	970	12.22	/	/	/	/
	Ag100	/	961(mp)	10.49	0.0163	429	/	180
	Au100	/	1064(mp)	19.3	0.0221	318	14	138
	Cu100	/	1083(mp)	8.96	0.0172	401	/	246

*Note : In this table, "e" indicates eutectic alloys, "ne" indicates near eutectic alloys and "mp" indicates  the melting point of simple substance. Other alloys can be customized for your requirement. For more details please contact us.