SAC305 Solder Paste
Features:
- Lead free solder paste, eutectic alloy with melting point 217-218 ºC;
- ROL0/ROL1 no cleaning flux;
- Excellent wettability;
- High insulation impedance after soldering.
Description:
SAC305 (Sn96.5Ag3Cu0.5) solder balancing demands of performance and price, is a typical of Sn-Ag-Cu (SAC) series solder. It is widely used in electronic brazing with higher hardness, tensile strength, yield strength, shear strength, impact strength, and creep strength than eutectic Sn63Pb37. On the other hand, its wetting properties are also better than Sn-Cu and Sn-Ag solder, and it is commonly used for reflow soldering, tin repair, and manual soldering.
Xianyi SAC305 lead-free solder paste adopts ROL0/ROL1 no-cleaning flux, which has no corrosion and high insulation impedance after soldering. It can be used in no-cleaning process and can meet the requirements of automated printing and dispensing applications.
Solder Paste Composition and Properties:
| Project |
Results |
| Appearance |
Grey, paste |
| Solder paste composition |
Sn96.5Ag3Cu0.5 (SAC305) |
| Melting temperature |
217-218ºC |
| Alloy powder number/ Particle size |
T3/ 25~45μm
T4/ 20~38μm
(Other particle size can be customized)
|
| Metal content |
80~90wt%
(Metal content can be adjusted upon request) |
| Flux Type |
ROL0/ ROL1 optional |
| Viscosity |
Typical value 200 ± 30 Pa.s
(Viscosity can be adjusted upon request) |
|
Method of Use:
Reflow Profile:
| Pre-heat |
Hold |
Reflow |
Cooling |
| Room temp ~ 150ºC |
130~ 170ºC |
217~245ºC |
217~Room temp |
| Heating rate |
Time |
Time |
Time |
Cooling rate |
| 1~3ºC/s |
60~90s |
60~ 120s |
40~80s |
1~3ºC/s |
(For reference only, the reflow profile should be adjusted according to the actual brazing situation)
Packing:
Canned: 500g/can;
10CC, 30CC needle tube packaging: 10g/tube, 30g/tube optional.
If other packaging specifications needed, please contact us.
Storage and Product Management
Refrigerated storage at 0-10 ºC, with a shelf life of 6 months.
After removing from low temperature, please keep the container sealed and return to room temperature before opening the lid for use.
Recommended warming time: 500g/can need 4-8 hours, needle tube need 1-2 hours.
The optimal environmental conditions for use are 24 ± 3 ºC and a relative humidity of 40-50%. After applying the solder paste, the mounting and reflow soldering should be completed as soon as possible to prevent the solder paste surface from drying out
and affecting the mounting and soldering effect due to exposure in air for long time. It is recommended to stay for no more than 4 hours. It is recommended to use up the solder paste as soon as possible within 12 hours after opening the lid. If used solder
paste needs to be stored, please use a clean and empty can to fill it, and then seal it and put it back in the refrigerator for storage. Recycled solder paste should be mixed with at least 2 parts of fresh solder paste.
Safety:
- Please use this product with adequate ventilation and certain personal protection conditions
- Please do not mix with other toxic chemicals.
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