Gold-Tin Solder Seal Lids for Simplified Packaging Process in Ausn Hermetic Packaging System

• Customization: Available
• Customized Support: OEM, ODM
• Lead Time: 1-2 Weeks
• Model NO.: Gold-Tin Solder Seal Lids
• Certificate: RoHS, ISO 9001, ISO 14001, GB/T 29490
• Delivery Method: Air Freight
• Transport Package: Waffle Box, Bulk Packaging
• Specification: Au80Sn20 Solder Seal Lids
• Trademark: XianYi
• Origin: Guangzhou
• HS Code: 8542900000
• Production Capacity: 10000000

Product Description

Gold-Tin Solder Seal Lids

Features:
-    Simplified packaging process
-    Six-sided electroplating, high corrosion resistance
-    Eutectic alloy, good wettability
-    Precise tacking
-    High gas tightness and high reliability


Description:
Au-Sn  alloy  solder  is  one  of  the  most  commonly  used  solders  in  hermetic packaging, and gold-tin solder preforms are widely used in hermetic packaging of metal or ceramic shells. In the traditional packaging process, it is difficult to locate the solder tabs, which often affects the gas tightness due to uneven solder.

The  AuSn  solder  seal  lid  consists  of  a  lid  with  a  gold-tin  solder  preform tack-welded on it. With the self-developed six side electroplating process and micro spot welding technology, the corrosion resistance  and firmness of the product are guaranteed, the positioning problem existing in the traditional process is solved, and the packaging process is simplified. The product has been widely used in hermetic packaging of microwave RF modules, FPGA, MEMS devices and optoelectronics.


Solder Composition: 

Element	Wt%
Gold (Au)	Margin
Tin (Sn)	20.0 ± 0.5

Specification 

Lid Material	4J29, 4J42, MoCu, ceramics, etc.
Lid Finishes	Ni:1.27-8.9 μm Au:0.65-5.7 μm * Plating structure can be customized according to customer requirements.

Method of Use
Referential soldering process
Operating environment

Atmosphere	Parameter requirements
N2	Oxygen concentration(200~ 1000ppm)
Vacuum	Vacuum degree ≤ 2.0×10-3Pa

Thickness of Au layer on pads
Au layer with a thickness of 0.8~1.5μm is favorable.

Reflow parameters

Reflow profile of Au80Sn20 Solder Preforms
(For reference only, the reflow profile should be adjusted according to the actual soldering situation)

Operation Details:
-    Picking up:
Use an anti-static tools to pick up the solder to prevent solder contamination and deformation.

Storage and Product Management:
-     Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.

-    Product management
Keep container tightly closed when product is not in use.

Safety:
-    Please use this product with adequate ventilation and certain personal protection conditions.
-    Please do not mix with other toxic chemicals.