Solder Preform Manufacturer, Brazing Preform, Solder Paste Supplier - Guangzhou Xianyi Electronic Technology Co., Ltd.

Popular Products

Solder Preforms Au80sn20 for Laser Diode Packaging with Gold-Tin Solder

FOB Price: US $0.1-3 / Piece

Min. Order: 1,000 Pieces

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Solder Preform In97AG3 for Low Temperature Lead-Free Solder in Indium-Silver Preform

FOB Price: US $0.1-3 / Piece

Min. Order: 1,000 Pieces

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Flux-Coated Solder Preforms for Simplified Soldering Process in Uniform Flux Coating

FOB Price: US $0.1-3 / Piece

Min. Order: 1,000 Pieces

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Solder Paste Au80sn20 for Printing and Dispensing Process Under Gold-Tin Eutectic Solder Alloy

FOB Price: US $130-250 / gram

Min. Order: 2 gram

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Solder Paste SAC305 for Electronic Brazing Under Sn96.5AG3cu0.5 Tin-Silver-Copper Solder Alloy

FOB Price: US $20-60 / kg

Min. Order: 5 kg

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Gold-Tin Solder Seal Lids for Simplified Packaging Process in Ausn Hermetic Packaging System

FOB Price: US $0.5-3 / Piece

Min. Order: 1,000 Pieces

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Gold-Tin Thin-Film Heatsink Submount for Laser Diode, Power Semiconductor with Ausn Layer

FOB Price: US $0.1-3 / Piece

Min. Order: 1,000 Pieces

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Solder Preform Au88Ge12 for High-Reliability Soldering in Gold-Germanium Preforms

FOB Price: US $0.1-3 / Piece

Min. Order: 1,000 Pieces

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Company Profile

Guangzhou Xianyi Electronic Technology Co., Ltd.

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	Business Type:	Manufacturer/Factory & Trading Company
	Main Products:	‪Solder Preform‬ , ‪Brazing Preform‬ , ‪Solder Paste‬ , ‪Ausn Solder Seal Lid‬ , ‪Nano-AG Paste‬ , ‪Flux‬ , ‪...‬
	Year of Establishment:	2008-12-10
	Number of Employees:	110
	Management System Certification:	ISO9001:2015, ISO14001, Others
	Address:	16 Lianyun 1st Heng Road, Shiqi Town, Guangzhou, Guangdong, China

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Established in 2008, Guangzhou Xianyi Electronic Technology Co., Ltd. Is the leading brand a national high-tech enterprise and a national "Little Giant" specializing in high-reliability microelectronic packaging materials and components.

Over decade of development, Xianyi has developed numerous core technologies via the integration of Reseach & Development, Production and Sales. The three main in-house developed products series are respectively Microelectronic packaging materials, Microelectronic ...

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