Solder Preform, Solder Paste, Flux manufacturer / supplier in China, offering Solder Paste SAC305 for Electronic Brazing Under Sn96.5AG3cu0.5 Tin-Silver-Copper Solder Alloy, Solder Preform Ag72Cu28 for Electronic Assembly in Silver-Copper Soldering, Solder Preform Bi57Sn42Ag1 for Low Temperature Microelectronic Packaging Assembly and so on.
Established in 2008, Guangzhou Xianyi Electronic Technology Co., Ltd. Is the leading brand a national high-tech enterprise and a national "Little Giant" specializing in high-reliability microelectronic packaging materials and components.
Over decade of development, Xianyi has developed numerous core technologies via the integration of Reseach & Development, Production and Sales. The three main in-house developed products series are respectively Microelectronic packaging materials, Microelectronic packaging components and Power semiconductor packaging materials.
Our flagship products are Gold-Tin solder materials and component, such as AuSn preform, AuSn paste, AuSn solder seal lids and AuSn submount. Xianyi was the first Chinese company to successfully developed and achieved mass production in China.
Xianyi is committed to providing customers with high-quality products, professional technical consultations and suitable process solutions. We have always been your best strategic partner in high-reliability packaging materials.
In the future, we aspire to become an "integrated service provider of microelectronic packaging and semiconductor device based on key core materials. "
Xianyi -- a foresighted, proactive enterprise which keep moving.