Gold-Tin Thin-Film Heatsink Submount for Laser Diode, Power Semiconductor with Ausn Layer

• Customization: Available
• Substrate Material: Aln, Al2O3, Wcu, Mocu, Quartz, Si, etc
• Metallization Layer: Ti/PT/Au, Ti/Ni/Au, Ausn etc
• Model NO.: Gold-Tin Thin-Film Submount
• Transport Package: Bulk, Blue Film Packaging
• Specification: Gold-Tin Thin-Film Heatsink Submount
• Trademark: XianYi
• Origin: Guangzhou
• HS Code: 8541900000
• Production Capacity: 10000000

Product Description

Gold-Tin Thin-Film Heatsink Submount

Features:
-        Alloy film with good solderability
-        Flexible process suitable for different batches
-       Eco-friendly

Description:
The AuSn thin film heat sink is a kind of AuSn solder coated submounts used as IC substrates or hermetic package lids in the packaging of devices such as laser diodes, power semiconductor devices and UVC LED. The thickness of AuSn solder on bonding
area can be precisely controlled within several micrometre. In the light that AuSn solder has been deposited on the surface of the substrate, no additional solder preforms or solder paste are necessary when soldering, resulting in high packaging efficiency.

Technical Specification: 

AuSn solder layer	Composition	AuSn, Au 70~80 ±5 wt.%
	Thickness & Tolerance	2~ 10 μm ± 20%
Substrate material	AlN , Al2O3, WCu, MoCu, quartz , Si , etc.
Metallization layer	Ti/Pt/Au, Ti/Ni/Au, etc.

Applications:

Gold-Tin Thin-Film Submount used in Laser Diode Pump Source Application

Storage and Product Management
-    Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.

-    Product management
Keep container tightly closed when product is not in use.

Safety:
-    Please use this product with adequate ventilation and certain personal protection conditions.
-    Please do not mix with other toxic chemicals.