AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging

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  • 3 yrs

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Product Highlights

  • Multiple Thickness Options: Available in 0.25, 0.3, 0.32, 0.4, 0.5, and 0.8 mm thicknesses.
  • Large Usable Area: Max usable area reaches 127*178 mm for flexible design.
  • Fast Sample Delivery: Samples are typically delivered within 2-3 days.
  • Bulk Order Lead Time: Bulk orders usually take 2-3 weeks depending on details.
  • 100% Product Inspection: All finished products undergo functional and visual inspection.
  • ISO Certified Quality: Certified under ISO9001:2015 and ISO14001 standards.
  • Factory Visit Welcome: Customers are welcome to visit the company or factory anytime.

Product Images of AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging

AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging pictures & photos
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging pictures & photos
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging pictures & photos
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging pictures & photos
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging pictures & photos
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging pictures & photos
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
  • AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
    AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
  • AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
    AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
  • AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
    AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
  • AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
    AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
  • AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
    AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
  • AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
    AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging

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Product Description

AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
Product Description
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
PRODUCT APPLICATION
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
Company Profile
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
Guangzhou Xianyi Electronic Technology Co., Ltd., established in December 2008, is a national high-tech enterprise and a national "Little Giant" specializing in high-reliability microelectronic packaging interconnect materials. 
Over decade of development, Xianyi has developed numerous core technologies via the integration of R&D, production, and sales. Three main in-house developed products series — Microelectronic packaging interconnect materials, Microelectronic packaging interconnect devices, and Power semiconductor packaging materials—have filled the domestic gap through in-house research and innovation, successfully achieving domestic mass production. 
Xianyi is committed to providing customers with high-quality products, professional technical consultations, and suitable process solutions. We have always been your best strategic partner in high-reliability packaging materials. 
In the future, we aspire to become an "integrated service provider of microelectronic packaging and semiconductor devices based on key core materials."
  Xianyi—a foresighted, proactive enterprise which keep moving.
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
AMB-High Thermal Conductivity AlN AMB Ceramic Substrates for Sic Power Device Packaging
FAQ
Q1: Are you Manufacturer or Trading company?
A: We are a manufacturer with 18 years experience in the production of solder preforms
, low-void solder paste & solder paste, solder balls, gold bonding wire & ribbo solder wire.
 
Q2: How Do We Place An Order?
A: Please send Email or WeChat with us, and let us know your requirements on type, quantities. We will reply you with Proforma Invoice based on your order request. Kindly check the PI and If everything is OK, after got your payment, we will deliver the goods for you ASAP.
 
Q3. Do you accept OEM orders?
A: No, we cannot change the packaging and factory labels. For further details, please contact our sales representative.
 
Q4: What is your advantage?
A: Manufacturers for better prices, good quality and reputation, professional sales services.
 
Q5: Can you offer the free sample for testing?
A: We can arrange samples for your company based on the situation. Please contact our sales representative for specific details.
 
Q6. How to store and How long is the warranty period?
A: Different products have varying storage requirements. Please store them properly according to the conditions specified in the product instructions we provided.
 
Q7. What is your terms of payment?
A: T/T 100% before delivery. The shipping details will be provided upon shipment of the products.
 
Q8. What about the delivery time?
A: Usually 2-3 days for samples and 2-3 weeks for bulk orders. Subject to the actual order details.
 
Q9. Can we visit your company/factory before place the order?
A: Yes. Welcome anytime.
 

About the Supplier

This supplier has been audited by SGS. Verify the report on the official SGS website with ID "QIP-ASR261196". Items marked "verified" are certified.

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Guangzhou Xianyi Electronic Technology Co., Ltd.
Guangzhou Xianyi Electronic Technology Co., Ltd.
Guangzhou Xianyi Electronic Technology Co., Ltd.
Guangzhou Xianyi Electronic Technology Co., Ltd.
Guangzhou Xianyi Electronic Technology Co., Ltd.
Guangzhou Xianyi Electronic Technology Co., Ltd.
Guangzhou Xianyi Electronic Technology Co., Ltd.
Guangzhou Xianyi Electronic Technology Co., Ltd.

About Our Factory & Business Background

verified Business Type
Manufacturer/Factory & Trading Company
Address
No. 12, Chuangyun Road, Shiqi Town, Panyu District, 511450 China, Guangzhou, Guangdong, China
verified Number of Employees
134
verified Registered Capital
17,234,900 RMB
verified Terms of Payment
T/T
verified International Commercial Terms(Incoterms)
FOB, EXW
verified Average Lead Time
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
verified Nearest Port
Guangzhou Port
verified Minimum Order Quantity
2000RMB

Our Production Capability & Technical Expertise

verified Main Products
AuSn Solder Preform, Other Alloy Solder Preform, AuSn Solder Seal Lid, AuSn Solder Paste, AuSn Thin Film Heat Sink
verified QA/QC inspectors
23 people
verified Inspection Type for Finished Products
100% inspection(Function inspection & Visual inspection)
verified Inspection Method for Finished Products
Have instructions and uniformly followed
verified Customization Options
Customization from Samples, Customization from Designs, Full Customization, Flexible customization, Minor Customization
verified ODM Service Available
Yes
verified Traceability of Raw Materials
Yes
verified Own Brand
Yes

Our Industry Experience & Global Business Record

verified Year of Establishment
2008-12-10
verified Export Year
3 Years
verified Main Markets
Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic
verified Repeat Buyers Choice
50%~80%
verified Overseas Agent/Branch
No
verified New Products Launched in Last year
Yes

Our Certifications, Standards & Industry Recognition

verified Management System Certification
ISO9001:2015, ISO14001, Others
verified Product Certification
Others
verified Cooperated with Fortune 500
No

FAQ

Are you Manufacturer or Trading company?
We are a manufacturer with 18 years experience in the production of solder preforms , low-void solder paste & solder paste, solder balls, gold bonding wire & ribbo solder wire.
Do you accept OEM orders?
No, we cannot change the packaging and factory labels. For further details, please contact our sales representative.
What is your advantage?
Manufacturers for better prices, good quality and reputation, professional sales services.
Can you offer the free sample for testing?
We can arrange samples for your company based on the situation. Please contact our sales representative for specific details.
How to store and How long is the warranty period?
Different products have varying storage requirements. Please store them properly according to the conditions specified in the product instructions we provided.
What is your terms of payment?
T/T 100% before delivery. The shipping details will be provided upon shipment of the products.
What about the delivery time?
Usually 2-3 days for samples and 2-3 weeks for bulk orders. Subject to the actual order details.
Can we visit your company/factory before place the order?
Yes. Welcome anytime.

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