High Solderability Thin Film Heat Sink for SiC Power Device Packaging

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Product Details
Customization: Available
Substrate Material: Ain, Ai203, Wcu, Mocu, Quartz, Si, etc
Metallization Layer: Ti/PT/Au, Ti/Ni/Au, etc.
Manufacturer/Factory & Trading Company

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  • High Solderability Thin Film Heat Sink for SiC Power Device Packaging
  • High Solderability Thin Film Heat Sink for SiC Power Device Packaging
  • High Solderability Thin Film Heat Sink for SiC Power Device Packaging
  • High Solderability Thin Film Heat Sink for SiC Power Device Packaging
  • High Solderability Thin Film Heat Sink for SiC Power Device Packaging
  • High Solderability Thin Film Heat Sink for SiC Power Device Packaging
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  • Overview
  • Product Description
  • PRODUCT APPLICATION
  • Company Profile
  • FAQ
Overview

Basic Info.

Transport Package
Vacuum Packaging
Specification
Customized to meet your specific needs
Trademark
Guangzhou XianYi Electronic Technology Co., Ltd
Origin
Guangzhou, Guangdong, China

Product Description

High Solderability Thin Film Heat Sink for SiC Power Device Packaging
Product Description
High Solderability Thin Film Heat Sink for SiC Power Device Packaging
High Solderability Thin Film Heat Sink for SiC Power Device Packaging
High Solderability Thin Film Heat Sink for SiC Power Device Packaging
PRODUCT APPLICATION
High Solderability Thin Film Heat Sink for SiC Power Device Packaging
High Solderability Thin Film Heat Sink for SiC Power Device Packaging
High Solderability Thin Film Heat Sink for SiC Power Device Packaging
High Solderability Thin Film Heat Sink for SiC Power Device Packaging
Company Profile
High Solderability Thin Film Heat Sink for SiC Power Device Packaging
Guangzhou Xianyi Electronic Technology Co., Ltd., established in December 2008, is a national high-tech enterprise and a national "Little Giant" specializing in high-reliability microelectronic packaging interconnect materials. 
Over decade of development, Xianyi has developed numerous core technologies via the integration of R&D, production, and sales. Three main in-house developed products series — Microelectronic packaging interconnect materials, Microelectronic packaging interconnect devices, and Power semiconductor packaging materials—have filled the domestic gap through in-house research and innovation, successfully achieving domestic mass production. 
Xianyi is committed to providing customers with high-quality products, professional technical consultations, and suitable process solutions. We have always been your best strategic partner in high-reliability packaging materials. 
In the future, we aspire to become an "integrated service provider of microelectronic packaging and semiconductor devices based on key core materials."
  Xianyi—a foresighted, proactive enterprise which keep moving.
High Solderability Thin Film Heat Sink for SiC Power Device Packaging
High Solderability Thin Film Heat Sink for SiC Power Device Packaging
FAQ
Q1: Are you Manufacturer or Trading company?
A: We are a manufacturer with 18 years experience in the production of solder preforms
, low-void solder paste & solder paste, solder balls, gold bonding wire & ribbo solder wire.
 
Q2: How Do We Place An Order?
A: Please send Email or WeChat with us, and let us know your requirements on type, quantities. We will reply you with Proforma Invoice based on your order request. Kindly check the PI and If everything is OK, after got your payment, we will deliver the goods for you ASAP.
 
Q3. Do you accept OEM orders?
A: No, we cannot change the packaging and factory labels. For further details, please contact our sales representative.
 
Q4: What is your advantage?
A: Manufacturers for better prices, good quality and reputation, professional sales services.
 
Q5: Can you offer the free sample for testing?
A: We can arrange samples for your company based on the situation. Please contact our sales representative for specific details.
 
Q6. How to store and How long is the warranty period?
A: Different products have varying storage requirements. Please store them properly according to the conditions specified in the product instructions we provided.
 
Q7. What is your terms of payment?
A: T/T 100% before delivery. The shipping details will be provided upon shipment of the products.
 
Q8. What about the delivery time?
A: Usually 2-3 days for samples and 2-3 weeks for bulk orders. Subject to the actual order details.
 
Q9. Can we visit your company/factory before place the order?
A: Yes. Welcome anytime.
 

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