High Precision Copper Pillar for Fowlp Fan-out Wafer Level Packaging

• Customization: Available
• Transport Package: Vacuum Packaging
• Specification: Customized to meet your specific needs
• Model NO.: Customized to meet your specific needs
• Trademark: Guangzhou XianYi Electronic Technology Co., Ltd
• Origin: Guangzhou, Guangdong, China

Product Description

1. Product Overview

Introducing the impeccable Copper Pillar meticulously crafted for IC packaging stud-bumping processes. Experience a transformative leap beyond traditional high-lead solder pillars with our cutting-edge solution that offers unparalleled thermal and electrical conductivity coupled with robust flexural strength, making it the perfect choice for high-frequency applications.

2. Specification

(1) Alloy Composition: Cu100, utilizing premium oxygen-free copper for optimal performance.
(2) Plating Options: Choose from Ni/Sn, Ni/Au, and more to suit your specific needs.
(3) Dimensions: Customizable with Diameter ØD and Length L for precision engineering.
(4) Tolerance: Diameter maintained at ±0.025mm, Length at ±0.05mm for exceptional accuracy.
(5) Dimensional Diagram

 

(6) Part Number
 

Part Number	Composition	Diameter	Length	Plating
XY-CuC-5015	Cu100 (Oxygen-Free Copper)	Ø0.5mm	1.5mm	None
XY-CuC-Sn5015	Cu100 (Oxygen-Free Copper)	Ø0.5mm	1.5mm	Ni/Sn
XY-CuC-Au5015	Cu100 (Oxygen-Free Copper)	Ø0.5mm	1.5mm	Ni/Au
XY-CuC-50221	Cu100 (Oxygen-Free Copper)	Ø0.5mm	2.21mm	None
XY-CuC-Sn50221	Cu100 (Oxygen-Free Copper)	Ø0.5mm	2.21mm	Ni/Sn
XY-CuC-Au50221	Cu100 (Oxygen-Free Copper)	Ø0.5mm	2.21mm	Ni/Au
XY-CuC-50254	Cu100 (Oxygen-Free Copper)	Ø0.5mm	2.54mm	None
XY-CuC-Sn50254	Cu100 (Oxygen-Free Copper)	Ø0.5mm	2.54mm	Ni/Sn
XY-CuC-Au50254	Cu100 (Oxygen-Free Copper)	Ø0.5mm	2.54mm	Ni/Au
XY-CuC-4015	Cu100 (Oxygen-Free Copper)	Ø0.4mm	1.5mm	None
XY-CuC-Sn4015	Cu100 (Oxygen-Free Copper)	Ø0.4mm	1.5mm	Ni/Sn
XY-CuC-Au4015	Cu100 (Oxygen-Free Copper)	Ø0.4mm	1.5mm	Ni/Au
XY-CuC-40221	Cu100 (Oxygen-Free Copper)	Ø0.4mm	2.21mm	None
XY-CuC-Sn40221	Cu100 (Oxygen-Free Copper)	Ø0.4mm	2.21mm	Ni/Sn
XY-CuC-Au40221	Cu100 (Oxygen-Free Copper)	Ø0.4mm	2.21mm	Ni/Au
XY-CuC-30127	Cu100 (Oxygen-Free Copper)	Ø0.3mm	1.27mm	None
XY-CuC-Sn30127	Cu100 (Oxygen-Free Copper)	Ø0.3mm	1.27mm	Ni/Sn
XY-CuC-Au30127	Cu100 (Oxygen-Free Copper)	Ø0.3mm	1.27mm	Ni/Au
XY-CuC-3015	Cu100 (Oxygen-Free Copper)	Ø0.3mm	1.5mm	None
XY-CuC-Sn3015	Cu100 (Oxygen-Free Copper)	Ø0.3mm	1.5mm	Ni/Sn
XY-CuC-Au3015	Cu100 (Oxygen-Free Copper)	Ø0.3mm	1.5mm	Ni/Au
XY-CuC Customized	Cu100 (Oxygen-Free Copper)	Ø0.10~0.9mm	0.3~4mm	Custom

3. Physical Properties

(1) Melting Point: Achieve peak performance with a melting point of 1083ºC.
(2) Density: 8.96g/cm³ ensuring compactness and reliability.3 (at room temperature)
(3) Tensile Strength: 246MPa offering formidable structural integrity.
(4) Electrical Resistivity: Just 0.0172μΩ·m for superior electrical performance.
(5) Thermal Conductivity: Exceptional at 401W/m·K, ideal for effective heat dissipation.
(6) Linear Thermal Expansion Coefficient: 16.5ppm/ºC, maintaining stability across temperatures.

4. Packaging Specifications

Meticulously packaged at 20,000 units per bottle with a Minimum Order Quantity of just 1 bottle.

5. Storage Conditions

(1) Enjoy a generous shelf life of 12 months.
(2) Optimal storage temperature ranges between 10°C-30°C.
(3) Relative humidity should be maintained between 30%RH-70%RH.
(4) Store in a pristine, dry, and clean environment to ensure longevity.
(5) The storage facility must adhere to strict conditions, staying clear of heat sources and direct sunlight. Avoid open stacking. Once opened, immediate use is advised; otherwise, store under nitrogen or fill with an inert gas to guard against oxidation from exposure to air.