


Company Profile
Leading Brand of Semiconductor Microassembly
Interconnecting Materials
Xianyi is committed to providing customers with high-quality products,professional technical consultations,and suitable process solutions. We have always been your best strategic partner in high-reliability packaging materials.
In the future,we aspire to become an "integrated service provider of microelectronic packaging and semiconductor devices based on key core materials."
Xianyi----a foresighted,proactive enterprise which keep moving.
Main Product
High-Voltage Power Device Ceramic Substrate for Enhanced Performance
US$5.00 / Piece
200 Pieces (MOQ)
US$0.10-3.00/ Piece
1,000 Pieces (MOQ)
US$0.50-3.00/ Piece
1,000 Pieces (MOQ)
US$0.06/ Piece
50,000 Pieces (MOQ)
US$0.10-3.00/ Piece
1,000 Pieces (MOQ)
Solder Preform
Low-Residue Flux Coated Au80sn20 Solder Preform for No-Clean Optoelectronic Packaging
US$0.05-20.00 / Piece
50 Pieces (MOQ)
Flux-Coated Solder Preforms for Simplified Soldering Process in Uniform Flux Coating
US$0.10-3.00 / Piece
1,000 Pieces (MOQ)
Solder Preform In100 for Low Temperature Indium-Based Solder in Laser Diode Applications
US$0.10-3.00 / Piece
1,000 Pieces (MOQ)
Solder Preform In97Ag3 for Low Temperature Lead-Free Solder in Indium-Silver Preform
US$0.10-3.00 / Piece
1,000 Pieces (MOQ)
Solder Preform Pb92.5sn5AG2.5 for High Temperature High Power Electronic Lead-Tin-Silver
US$0.10-3.00 / Piece
1,000 Pieces (MOQ)
Solder Preform Ag72Cu28 for Electronic Assembly in Silver-Copper Soldering
US$0.10-3.00 / Piece
1,000 Pieces (MOQ)
High-Quality Au88ge12 Solder Preforms for Reliable Gold-Germanium Applications
US$0.10-3.00 / Piece
1,000 Pieces (MOQ)
Low-Temperature Flux Coated In52Sn48 Solder Preform for Low-Process Packaging of Ultra-Low Temperature Devices
US$0.05-20.00 / Piece
50 Pieces (MOQ)
Solder Wire
Sulfurization Resistant Gold Bonding Ribbon for Microwave Circuit Packaging
US$150.00-300.00 / Roll
5 Rolls (MOQ)
Precision Fine Diameter Sn96.5Ag3.5 Solder Wire for Chip-Level Assembly
US$150.00-200.00 / Roll
5 Rolls (MOQ)
High Thermal Conductivity Gold Bonding Ribbon for High-Frequency Device Packaging
US$150.00-300.00 / Roll
5 Rolls (MOQ)
High Temperature Resistant Gold Bonding Ribbon for Aerospace Electronic Packaging
US$150.00-300.00 / Roll
5 Rolls (MOQ)
Anti-Oxidation Gold Bonding Wire for Military Electronic Packaging
US$150.00-300.00 / Roll
5 Rolls (MOQ)
Other welding materials & accessories
High Precision Aluminum Heat Sinks for Electronic Components Cooling
US$3.00-50.00 / Piece
500 Pieces (MOQ)
High Hermeticity Au80Sn20 Seal Lid for Hermetic Packaging of Microwave RF Modules
US$2.00-10.00 / Piece
100 Pieces (MOQ)
High Reliability AMB Ceramic Substrates for Power Electronics & IGBT
US$10.00-15.00 / Piece
200 Pieces (MOQ)
Gold-Tin Solder Seal Lids for Simplified Packaging Process in Ausn Hermetic Packaging System
US$0.50-3.00 / Piece
1,000 Pieces (MOQ)
Solder Paste Au80Sn20 for Printing and Dispensing Process Under Gold-Tin Eutectic Solder Alloy
US$130.00-250.00 / gram
2 gram (MOQ)

Established in 2008
Guangzhou Xianyi Electronic Technology Co.,Ltd.

National high-tech enterprise
Guangzhou Xianyi Electronic Technology Co.,Ltd.

A foresighted,proactive enterprise which keep moving
Guangzhou Xianyi Electronic Technology Co.,Ltd.
COMPANY PROFILE
Established in 2008, Guangzhou Xianyi Electronic Technology Co., Ltd. is the leading brand a national high-tech enterprise and a national "Little Giant" specializing in high-reliability microelectronic packaging materials and components.
Over decade of development, Xianyi has developed numerous core technologies via the integration of Reseach & Development, Production and Sales. The three main in-house developed products series are respectively Microelectronic packaging materials, Microelectronic packaging components and Power semiconductor packaging materials.
Our flagship products are Gold-Tin solder materials and component, such as AuSn preform, AuSn paste, AuSn solder seal lids and AuSn submount. Xianyi was the first Chinese company to successfully developed and achieved mass production in China.
Xianyi is committed to providing customers with high-quality products, professional technical consultations and suitable process solutions. We have always been your best strategic partner in high-reliability packaging materials.
In the future, we aspire to become an "integrated service provider of microelectronic packaging and semiconductor device based on key core materials. "
Xianyi -- a foresighted, proactive enterprise which keep moving.
Over decade of development, Xianyi has developed numerous core technologies via the integration of Reseach & Development, Production and Sales. The three main in-house developed products series are respectively Microelectronic packaging materials, Microelectronic packaging components and Power semiconductor packaging materials.
Our flagship products are Gold-Tin solder materials and component, such as AuSn preform, AuSn paste, AuSn solder seal lids and AuSn submount. Xianyi was the first Chinese company to successfully developed and achieved mass production in China.
Xianyi is committed to providing customers with high-quality products, professional technical consultations and suitable process solutions. We have always been your best strategic partner in high-reliability packaging materials.
In the future, we aspire to become an "integrated service provider of microelectronic packaging and semiconductor device based on key core materials. "
Xianyi -- a foresighted, proactive enterprise which keep moving.
Authentication
Business Type:
Manufacturer/Factory & Trading Company
Main Products:
AuSn Solder Preform
,
Other Alloy Solder Preform
,
AuSn Solder Seal Lid
,
AuSn Solder Paste
,
AuSn Thin Film Heat Sink
Year of Establishment:
2008-12-10
Number of Employees:
134
Management System Certification:
ISO9001:2015, ISO14001, Others
Address:
No. 12, Chuangyun Road, Shiqi Town, Panyu District, 511450 China, Guangzhou, Guangdong, China
Solutions
OEM/ODM
Factory Tour
Sample Order



